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Layer： 28L
Board thickness：3.0mm±0.28mm
Size：300mm*340mm
Min line width/space：0.1mm/0.1mm
Min blind via/aspect ratio： 0.125mm/0.75
Min distance between PTH and line：0.175mm
Finish: ENIG
Application: communication
Technical feature: 3+N+3,olverlap buried and blind vias
printed wiring board
